The AMD Ryzen AI 9 HX 370 is a cutting-edge 12-core/24-thread mobile processor designed for high-performance laptops and compact systems like mini PCs. Built on Zen 5 and Zen 5c hybrid architecture with 4nm technology, it combines efficiency and power with a 5.1GHz boost clock, Radeon 890M RDNA 3.5 graphics, and an integrated XDNA 2 NPU delivering 50 TOPS for AI workloads. Its 80W thermal design power enables desktop-class multitasking and rendering in space-constrained devices.
Small Home Server Build: The Perfect Server with a Mini PC
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Top 5 Mini PCs in 2025
| Rank | Model | Processor | RAM | Storage | Price | Action |
|---|---|---|---|---|---|---|
| 1 | GEEKOM Mini IT12 (Best Performance) | Intel i5-12450H (8C/12T) | 16GB DDR4 | 512GB PCIe Gen4 SSD | $379.00 | Check Price |
| 2 | GMKtec N150 (1TB SSD) | Intel N150 (3.6GHz) | 16GB DDR4 | 1TB PCIe M.2 SSD | $191.99 | Check Price |
| 3 | KAMRUI GK3Plus (Budget Pick) | Intel N95 (3.4GHz) | 16GB DDR4 | 512GB M.2 SSD | $169.99 | Check Price |
| 4 | ACEMAGICIAN N150 (Cheapest 16GB) | Intel N150 (3.6GHz) | 16GB DDR4 | 256GB SSD | $139.99 | Check Price |
| 5 | GMKtec N150 (512GB SSD) | Intel N150 (3.6GHz) | 16GB DDR4 | 512GB PCIe SSD | $168.99 | Check Price |
What architectural innovations define the Ryzen AI 9 HX 370?
Zen 5 hybrid cores and XDNA 2 AI acceleration set this processor apart. The Zen 5+Zen 5c design pairs four full-performance cores with eight compact cores, optimizing multi-threaded workloads while maintaining thermal efficiency in mini PC form factors.
Beyond raw clock speeds, the HX 370 introduces architectural refinements like improved branch prediction and doubled L1 data cache bandwidth. The XDNA 2 NPU isn’t just an AI co-processor—it’s a full-stack solution handling Windows Studio Effects, Stable Diffusion, and real-time language models locally. Pro Tip: When configuring mini PCs with this chip, prioritize dual-channel DDR5-6400 RAM to fully utilize the 890M GPU’s 16 compute units. For example, in Blender benchmarks, the HX 370 completes renders 40% faster than Intel’s Core Ultra 185H while drawing 15% less power. Thermal management becomes critical—expect sustained 80W loads to require vapor chamber cooling in sub-2L chassis.
How does it compare to previous-gen mobile processors?
The HX 370’s 50 TOPS NPU and Zen 5 IPC gains create generational leaps. Cinebench R23 multi-core scores hit 24,025—38% higher than AMD’s prior 28W mobile chips—while maintaining 95°C thermal limits common in mini PC thermal envelopes.
| Metric | HX 370 | Intel Ultra 9 185H |
|---|---|---|
| Multi-Core (R23) | 24,025 | 19,800 |
| AI Performance (TOPS) | 50 | 34 |
| GPU Compute Units | 16 | 8 |
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FAQs
Yes—the Radeon 890M achieves 45+ FPS in AAA titles at 1080p medium settings. Use dual-channel RAM and PCIe 4.0 NVMe storage to eliminate bottlenecks.
Is liquid cooling required for HX 370 mini PCs?
Not mandatory, but recommended for sustained workloads. Quality vapor chambers can maintain 4GHz+ all-core clocks at 45dB noise levels in 1.5L cases.